Corning's Advanced Bare Wafers

 

Corning provides advanced semiconductor glass wafers and carrier wafers made from proprietary alkaline earth boro-aluminosilicate materials, which offer exceptional mechanical strength, low total thickness variation (TTV), and optimized thermal properties for advanced semiconductor packaging, thinning, and through-glass-via applications. Their glass wafers are used in processes such as temporary bonding, debonding, wafer thinning, and 3D-IC packaging, meeting standards like SEMI 3D2-0013.

 
Key Products and Technologies
• Advanced Packaging Glass Carriers:

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These glass wafers are essential for temporary bonding and debonding applications in advanced packaging. They help reduce warp during these processes, ensuring high throughput and overall process efficiency.
• Through-Glass-Vias (TGV):

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Corning offers precision glass with precision vias for RF and interposer applications, enabling smaller package sizes and better performance. These vias are metallized and can be filled with copper, aluminum, or gold to create electrical connections through the glass wafer.
• High UV Transmission Glass Carriers:

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Developed in response to market demand for light-based debonding processes, these carriers provide uniform light distribution and minimize heat problems during manufacturing.
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Materials and Manufacturing
• Alkaline Earth Boro-Aluminosilicate:

  This unique glass composition, combined with Corning's proprietary fusion process, is the foundation for their semiconductor glass wafers.
• Fusion Process:

  This process enables the creation of glass wafers with extremely low total thickness variation (TTV) and a pristine surface.
Benefits and Applications
• Mechanical Strength and Warp Reduction:

  Corning's glass carriers are engineered for outstanding mechanical strength and significantly reduce wafer warp during advanced packaging processes.
• Optimized Thermal Properties:

  The glass features optimized thermal properties, such as a tailored Coefficient of Thermal Expansion (CTE), making it ideal for various semiconductor applications.
• Electrical Performance:

  As an insulator, glass offers very low electrical loss, especially at high frequencies, which is beneficial for RF applications.
• Versatile for 3D-IC and Panel-Level Packaging:

  The technology supports 3D-IC applications and also explores panel-level packaging, which can reduce manufacturing costs by creating thousands of printed circuit boards on a single glass panel