Intel’s RAMP-C

 

Intel's RAMP-C.

Rapid Assured Microelectronics Prototypes - Commercial (RAMP-C) is a U.S. government program to establish a secure, domestic supply chain for cutting-edge semiconductors. Led by Intel Foundry, the program aims to provide the U.S. Department of Defense (DoD) and the defense industrial base (DIB) with access to Intel's most advanced chip technologies. 

Background and purpose

• Addressing supply chain vulnerabilities: More than 80% of the world's leading-edge chip manufacturing is in Asia, which poses a national security risk for the U.S.. The RAMP-C program was established by the DoD to mitigate this risk.
• Fostering a domestic ecosystem: By leveraging a commercial foundry ecosystem, RAMP-C helps reduce the DoD's reliance on foreign manufacturing. It also allows DIB partners to benefit from the cost efficiencies of high-volume commercial production.
• Boosting U.S. leadership: RAMP-C is part of a broader U.S. effort to accelerate leadership in semiconductor design, manufacturing, and packaging. 

Intel's role and key phases

Intel Foundry has been a central partner in the RAMP-C program since its launch in October 2021. The program has progressed through three main phases: 

• Phase 1: Foundation Building: Intel led efforts to develop the necessary technology, intellectual property (IP), and ecosystem tools to prepare customers for test chip fabrication.
• Phase 2: Expansion and Onboarding: Intel brought on major DIB customers, including Boeing and Northrop Grumman, to begin designing and developing solutions using its advanced process technologies.
• Phase 3: Advanced Prototyping and Manufacturing: Awarded in April 2024, this phase involves the tape-out (finalizing the design) and testing of DIB product prototypes using Intel's 18A process technology. This phase includes new DIB customers like Trusted Semiconductor Solutions and Reliable MicroSystems. 

Technology and partners

• Process technology: A key goal of RAMP-C is to provide access to Intel's leading-edge technology. Phase 3 heavily features the Intel 18A process, which includes next-generation innovations like RibbonFET gate-all-around (GAA) transistors and PowerVia backside power delivery.
• Advanced packaging: The program also includes Intel's advanced packaging capabilities, such as Embedded Multi-die Interconnect Bridge (EMIB), to create complex, heterogeneous chiplet designs for high-performance computing.
• Ecosystem partners: To build a robust supply chain, Intel works with numerous industry partners through its U.S. Military, Aerospace and Government (USMAG) Alliance. Partners include:
  • Electronic Design Automation (EDA): Cadence and Synopsys
  • Defense Contractors: Boeing and Northrop Grumman 

Connection to other programs

RAMP-C is part of a larger DoD initiative that also includes the following programs: 

• Rapid Assured Microelectronics Prototypes (RAMP): Focused on secure design and prototyping.
• State-of-the-Art Heterogeneous Integrated Packaging (SHIP):Focused on advanced packaging and testing.