From ChatGPT, today:
Current Status of TSMC’s Phoenix Fabs
** fab 1: Operational**
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TSMC commenced high-volume production of 4-nanometer chips (N4 technology) in late 2024 — a historic first for leading-edge chip manufacturing on U.S. soil.
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The yield and quality are on par with TSMC’s Taiwan facilities, a significant validation of local manufacturing capabilities.
** fab 2: Construction Complete**
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The second fab, built for 3-nanometer (N3) production, is structurally complete as of early 2025.
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Original plans aimed for production around 2028, though further delays may modestly shift this timeline.
** fab 3: Groundbreaking Phase**
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Ground was broken in April 2025 for the third fab, targeting 2-nanometer (N2) and Apple’s A16-class process technologies. This is slated to become operational by the end of the decade.
Project Timeline & Delays
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Fab 1 faced a delay from early 2024 to 2025 due to a shortage of skilled workers for complex equipment installations, prompting TSMC to import hundreds of Taiwanese technicians.
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Fab 2’s N3 launch, initially targeted for around 2026, now looks more likely in 2027–2028.
U.S. Expansion & Economic Impact
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TSMC’s announced investment in Arizona has surged from an original $12 billion to a massive $165 billion, including planned additions like packaging facilities and an R&D center.
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Shortly after the Phoenix fab operations began, Starlux Airlines announced the U.S.’s first nonstop flight from Phoenix to Taipei — a sign of TSMC’s growing economic influence in the region.
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Plans are also underway for a 25–30% higher operating cost in Arizona compared to Taiwan due to materials and logistics, though major tech clients like Apple, NVIDIA, AMD, and Qualcomm remain committed to sourcing from the U.S. facility.
To what extent is USA - TSMC keeping up with US chip demand?
You’re asking how well TSMC is meeting U.S. chip demand through its Arizona operations—and the answer is: it’s significant, but still far from sufficient.
TSMC U.S. Capacity vs. Demand
1. Limited Coverage of U.S. Chip Needs
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U.S. Treasury Secretary Scott Bessent warned that TSMC’s Arizona fab may address just about 7% of total U.S. chip demand—a modest share given overall appetite.
2. U.S. Fab Capacity Fully Booked
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TSMC’s U.S. fabs in Arizona are fully booked through at least 2025 and likely into 2026, despite high demand from major clients like Apple, Nvidia, AMD, Qualcomm, and Broadcom.
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In response to demand, TSMC is accelerating its fab build-out and ramp schedules—including advancing its 3nm production timelines.
3. Expanding U.S. Investment
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TSMC’s investment in U.S. chip manufacturing has reached $165 billion, with plans for multiple new fabs, packaging facilities, and an R&D center.
4. Higher Costs & Regulatory Delays
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Production in Arizona is roughly 20–30% costlier than in Taiwan due to construction, logistics, and regulatory burdens.
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Delays and rising costs are compounded by complex U.S. regulations, leading to slower deployment of advanced nodes like N3, N2, and A16.
5. Supply Chain Gaps Still Exist
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Despite wafer manufacturing in Arizona, advanced packaging is largely still done in Taiwan, creating reliance on trans-Pacific logistics.
Summary Table
Bottom Line
TSMC is making a strong, multi-billion-dollar effort to localize advanced chip manufacturing in the U.S., and demand is soaring. That said, current capacity covers only a fraction of U.S. needs—about 7%—and expansion faces cost, regulatory, and logistical hurdles. The ramp-up will continue, but bridging the gap will take time, investment, and policy improvements.
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